Press Releases

Telink Semiconductor’s RF system on chip (SoC) passes ZigBee 3.0 certification tests using DSR’s wireless software stack

Shanghai, China, 5 January 2017 – Telink Semiconductor, developer of highly integrated low power chips for Internet of Things (IoT) applications, has announced that its ZigBee RF SoC has passed the ZigBee compliant platform tests based on the latest ZigBee stack specification using DSR Corporation’s ZBOSS 3.0 ZigBee 3.0 wireless stack, and thus can start to provide a ZigBee 3.0 SDK (software development kit) to its customers.

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