Press Release

Telink Semiconductor’s RF system on chip (SoC) passes ZigBee 3.0 certification tests using DSR’s wireless software stack

Telink Semiconductor, developer of highly integrated low power chips for Internet of Things (IoT) applications, has announced that its ZigBee RF SoC has passed the ZigBee compliant platform tests based on the latest ZigBee stack specification using DSR Corporation’s ZBOSS 3.0 ZigBee 3.0 wireless stack, and thus can start to provide a ZigBee 3.0 SDK (software development kit) to its customers.

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Neural computing technology leader BrainChip appoints T2M for global marketing, representation and business development

BrainChip Holdings Limited (ASX: BRN), developer of a revolutionary embeddable semiconductor solution enabling hardware-based autonomous learning systems and applications, has signed a commercial marketing agreement with T2M, the world’s largest independent global semiconductor technology provider. Under the terms of the agreement T2M will act as a global representative of BrainChip’s technology solutions.

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