The partnership, established by T2M, is designed to take various forms including direct wafer supply, IP licensing, and custom product development
DSR, a company with decades of wireless communication embedded software stack development experiences, has announced that its ZBOSS 3.0 ZigBee 3.0 software is supporting CSEM 802.15.4 solution.
Telink Semiconductor, developer of highly integrated low power chips for Internet of Things (IoT) applications, has announced that its ZigBee RF SoC has passed the ZigBee compliant platform tests based on the latest ZigBee stack specification using DSR Corporation’s ZBOSS 3.0 ZigBee 3.0 wireless stack, and thus can start to provide a ZigBee 3.0 SDK (software development kit) to its customers.
BrainChip Holdings Limited (ASX: BRN), developer of a revolutionary embeddable semiconductor solution enabling hardware-based autonomous learning systems and applications, has signed a commercial marketing agreement with T2M, the world’s largest independent global semiconductor technology provider. Under the terms of the agreement T2M will act as a global representative of BrainChip’s technology solutions.