Press Release

Broadcom issues patent suit broadside targeting LG, Mediatek and Funai

Broadcom launched a number of patent infringement lawsuits against Asian and US companies this week, in what looks to be the Singapore-based chipmaker’s first concerted assertion campaign since its reconfiguration through merger last year. The litigation is the latest step in an escalating value-creation effort on the part of the new entity.
The company’s US unit, Broadcom Corporation, filed six suits in the Central District of California on Monday concerning audiovisual technologies. In court documents seen by IAM, Broadcom states that the accused products targeted by the litigation “are generally semiconductor components… such as, for example, various system-on-a-chip (SoC) and similar processing components and circuits” and “consumer audiovisual products incorporating such SoCs, including… digital televisions, set-top boxes, Blu-ray disc players, DVD players/recorders, DTV/DVD combinations, DTV/Blu-Ray combinations, multimedia streaming players, home theater systems, and other similar audiovisual devices and systems”.
The defendants are LG Electronics, Mediatek and its subsidiary MStar Semiconductor, Japanese manufacturer Funai, US chipmaker Sigma Design and US consumer electronics company Vizio, which is currently the subject of a $2 billion takeover bid from China’s LeEco. The patents being enforced by Broadcom include:
• US patent 7,310,104 – ‘Graphics display system with anti-flutter filtering and vertical scaling feature’ (only asserted against Sigma Design)
• US patent 7,342,967 – ‘System and method for enhancing performance of personal video recording (PVR) functions on hits digital video streams’ (not asserted against Funai)
• US patent 7,590,059 – ‘Multistandard video decoder’
• US patent 8,068,171 – ‘High speed for digital video’ (not asserted against Mediatek)
• US patent 8,284,844 – ‘Video decoding system supporting multiple standards’
Each of the patents was originally assigned to Broadcom Corporation before it was acquired by US-Singaporean semiconductor company Avago Technologies in a $37 billion merger deal announced in May 2015, which saw the combined entity adopt the Broadcom brand.
In its filings with the Central California court, Broadcom provides some eye-catching detail on its R&D and IP holdings. The company claims that from 2015 to 2016, it spent $3.7 billion on product-related R&D, with $2.7 billion of that being spent in 2016 alone. Prior to Avago’s buyout, US-based Broadcom Corporation spent between $2.3 billion and $2.5 billion in the three-year period ending 2014. The filing documents further claim that as of the end of October last year, post-merger Broadcom as a whole held approximately 27,640 patents and 3,020 pending applications worldwide, with its R&D activities resulting in around 350 patent applications each year on average.
By the time the Avago-Broadcom merger was reported as having completed in February 2016, the company had become the owner of one of the world’s largest patent portfolios, easily slotting in among the top 15 holders of US-issued assets. In 2016, the US Intellectual Property Owners Association identified Broadcom (listed as Avago) as the second biggest gainer in terms of US patent grants, its 144% year-on-year growth putting it just behind fellow chipmaker NXP’s 148% increase.
It would seem that there has been impetus from within Broadcom to extract more value from the substantial portfolio it now has on its hands. One notable event in this regard was its assignment of several US patents to Xiaomi in late 2015, which represented the Chinese start-up’s first known straight purchase of third-party patents. In June last year, it sued Sony for alleged infringement of numerous patents, some of which Avago had acquired through its takeovers of LSI and Broadcom Corporation; this was followed by a suit targeting Amazon and its Web Services business in September. The litigation launched in California this week looks like it represents another step in this direction.

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BrainChip to present at TechKnow Invest Roadshow

SAN FRANCISCO, CA — (Marketwired) — 10/12/17 — BrainChip Holdings Ltd. (“BrainChip” or the “Company”) (ASX: BRN), a leading developer of software and hardware accelerated solutions for advanced artificial intelligence (AI) and machine learning applications, is pleased to announce that the Company will be presenting at the TechKnow Invest Roadshow in Melbourne, Australia on 24 October 2017 and Sydney, Australia on 26 October 2017.

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CCww’s NB-IOT R13 Protocol-stack software is licensed by a leading IoT Chip developer

Bournemouth, UK, 25th Sep 2017 – Communications Consultants Worldwide Ltd. (CCww), global innovator of 3GPP technologies has licensed its NB-IoT protocol-stack software to a leading Shanghai and Silicon Valley based developer of highly integrated and unique mixed-signal SoC solutions. This relationship, catalyzed by T2M, will enable the production of the highly integrated NB-IoT SoC chipset targeting IoT, Logistics, Smart metering, Health and Fitness markets.
NB-IoT (Narrow-Band Internet-of-Things) is the future global solution to low-cost and low-power for cellular machine-to-machine connectivity, for use in metering, telematics, security… where very low maintenance and up to 10-years battery-life are required. CCww’s NB-IoT R13 Protocol-stack SW is enabling chip manufacturers and module manufacturers to rapidly enter the market with small-footprint, broadly-tested, and stable SW. R14 is under development, and will be available in 2Q18.
CCww’s CEO, Richard Carter, said, “NB-IoT is CCww’s latest cellular Protocol-stack SW, in a long history of protocol-stack development. We are excited to be working with our latest licensee to enable a sector-leading NB-IoT SoC, which will push back boundaries of performance and efficiency for the next generation of IoT.”
Nigel Dixon, CEO of T2M, remarked “Our global relationships in the semiconductor market coupled with our extensive expertise in wireless semiconductor technology enabled us to join the latest licensee with a leading NB-IOT protocol-stack SW and support provider, to take them through integration, certification and mass deployment. We are excited to be enabling companies to build leadership products with our clients’ state-of-the-art technologies”.

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Telink Semiconductor to demonstrate smart lighting, smart home, retail and logistics applications at Bluetooth Asia 2017 in Shenzhen

Shanghai, China, 18 September 2017 – Telink Semiconductor, developer of highly integrated low power radio-frequency and mixed signal system chips for internet of things (IoT) applications, will be demonstrating a number of applications for smart lighting, smart home, retail and logistics based on its devices at the Bluetooth Asia 2017 conference taking place in Shenzhen, China on 26-27 September 2017.

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BrainChip Studio Awarded New Product of the Year for Video Analytics by Security Today’s Panel of Independent Judges

ALISO VIEJO, CA — (Marketwired) — 08/22/17 — BrainChip Holdings Ltd. (ASX: BRN) (“BrainChip” or “the Company”), a leading developer of software and hardware accelerated solutions for advanced artificial intelligence (AI) and machine learning applications, has won the Security Today’s New Product of the Year Award 2017 in the Video Analytics category for its BrainChip Studio software suite. The award honors the outstanding products considered to be particularly noteworthy in their ability to improve security. The trophy will be accepted by BrainChip during the ASIS International 63rd Annual Seminar and Exhibits, September 25th – 28th, Dallas, Texas.

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Telink Semiconductor’s RF system on chip (SoC) passes ZigBee 3.0 certification tests using DSR’s wireless software stack

Telink Semiconductor, developer of highly integrated low power chips for Internet of Things (IoT) applications, has announced that its ZigBee RF SoC has passed the ZigBee compliant platform tests based on the latest ZigBee stack specification using DSR Corporation’s ZBOSS 3.0 ZigBee 3.0 wireless stack, and thus can start to provide a ZigBee 3.0 SDK (software development kit) to its customers.

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Neural computing technology leader BrainChip appoints T2M for global marketing, representation and business development

BrainChip Holdings Limited (ASX: BRN), developer of a revolutionary embeddable semiconductor solution enabling hardware-based autonomous learning systems and applications, has signed a commercial marketing agreement with T2M, the world’s largest independent global semiconductor technology provider. Under the terms of the agreement T2M will act as a global representative of BrainChip’s technology solutions.

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