Press Releases

T2M announces its first Image Signal Processing (ISP) Technology for advanced mobile camera applications

Munich, Germany, 28 Septemeber 2018 - T2M, the world’s largest independent global semiconductor IP provider, announced the launch of its first low-power digital image processor IP designed to perform advanced image correction and enhancement, resulting in superior image quality in today’s multi-megapixel cameras. Its’ built-in high-level features include face tracking, video stabilization and a smooth digital zoom, bringing an outstanding user experience to camera systems.

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T2M to showcase cutting-edge Cellular and Low Power Wireless IoT technologies at MWC Shanghai 2018

Munich, June 20, 2018 – T2M, the world’s largest independent global semiconductor IP technology provider today announced that they will be showcasing their latest Cellular and Low Power Wireless IoT technology IP at MWC Shanghai on 27, 28 and 29th June at the Shanghai New International Expo Centre. Mobile World Congress Shanghai is the must-attend industry event in Asia. With over 60,000 attendees, the event represents the entire mobile and technology eco-system in areas of: Artificial Intelligence, Automotive, Devices and IoT. At the show, you can experience demos and discuss with T2M experts on our cutting-edge IP: Cellular IOT SoC IP  NB-IOT/Cat M1 Phy & PS SW  NB-IOT RF IP  GNSS SW IP (DSP/CPU)  GNSS RF IP & Rx  GSM Phy & PS SW Low Power Wireless Connectivity SoC IP Technology (BQB & ZigBee Alliance Certified)  BLE v5 / 15.4 Digital LL & MAC  BLE v5 / 15.4 RF IP (0.5mm2)  BLE v5 SW Stack & Profiles  Bluetooth Mesh v1.0 SW  ZigBee v3 SW Stack & Profiles When: 27 – 29 June, 2018 Location: Shanghai New International Expo Centre To Book a Meeting, Click here. About T2M T2M is the world's largest independent global semiconductor technology provider, supplying complex IP, software, KGD and disruptive technologies enabling accelerated production of IoT, wireless, consumer and automotive electronics devices. Located in all key tech clusters around the world, our senior management team provides local access to leadership companies and technology. For more information, please visit www.t-2-m.com

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T2M and Mindtree to showcase cutting-edge BQB-qualified Mesh SW and Bluetooth 5 IP at Bluetooth Asia, Shenzhen

Munich, May 16, 2018 – T2M, the world’s largest independent global semiconductor technology provider today announced that, Mindtree, will be showcasing their customer proven BQB-qualified Bluetooth Mesh v1.0 software and Bluetooth Low Energy 5.0 Modem, Digital Link Layer, Protocol Stack SW and Profiles IP at Bluetooth Asia 2018 on 30, 31 May at Shenzhen Convention & Exhibition Centre, Booth #34.

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Unveiling the world’s lowest power voice detection

Breakthrough innovation specialists Cambridge Consultants today reveal “Ecoutez”, the world's lowest power, flexible IP block for accelerating Voice Activity Detection (VAD) processing. Alexa™ and Google Home™ are blazing a trail for ‘always-on’ functionality, but attention now turns to the energy consumption of such devices. Massive power efficiency will be vital if voice detection is to make the leap to battery-powered devices. The Ecoutez VAD design requires a tiny 11µW (microwatts) to perform accurate classification of audio signals. This is about 100th of the power consumed by modern hearing aids. As a result, the Ecoutez design will be a critical enabler for applications where the VAD is always on, opening the door to future innovation in voice recognition technologies.

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T2M announces availability of Bluetooth SIG qualified v5 Bluetooth Low Energy Controller, Stack and Profiles IP from Mindtree

Munich, Germany, 19th April 2018 - T2M, the world’s largest independent global semiconductor technology provider, announced the availability of Mindtree’s BQB (Bluetooth Qualification Body) qualified Bluetooth v5 Controller, Stack and Profiles (Declaration ID #D038059 and #D038060). This makes Mindtree the first company to qualify a full featured Bluetooth Low Energy 5 IP with TCRL 2 Specifications. This IP has already been licensed to multiple Tier 1 microcontroller semiconductor companies and will be showcased in the upcoming Bluetooth Asia (May 30th, 31st 2018) in Shenzhen. Meet us at Bluetooth Asia, Click HERE.

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Bluetooth Mesh – the Next Wave of IoT Technology

1. Introduction: The market for Bluetooth low energy devices is expected to reach 1.4 Billion, growing at a CAGR of 34% between 2015 to 2021, as per ABI Research. While investments in Internet-of-Things (IoT) technology are ever increasing, there are many wireless technologies such as Zigbee, Wi-Fi, Bluetooth and Z-wave competing for adoption. The choice of wireless technology depends on the use case and key requirements such as power, latency, reliability, scalability, interoperability,range, cost and bandwidth. The adoption of the Bluetooth low energy (Bluetooth LE) specifications v4.0/v4.2 standards is being driven by adoption in several markets such as the Health and Fitness devices, Beacons, Asset tracking, Home automation, PC Peripherals etc. Bluetooth low energy 5, together with the Bluetooth LE Mesh specifications are set to make Bluetooth the ‘Connectivity of Choice’ in IoT markets such as Connected Home, Commercial Lighting and Industrial Wireless Sensor Network markets.

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