Press Releases

T2M announces availability of Bluetooth SIG qualified v5 Bluetooth Low Energy Controller, Stack and Profiles IP from Mindtree

Munich, Germany, 19th April 2018 - T2M, the world’s largest independent global semiconductor technology provider, announced the availability of Mindtree’s BQB (Bluetooth Qualification Body) qualified Bluetooth v5 Controller, Stack and Profiles (Declaration ID #D038059 and #D038060). This makes Mindtree the first company to qualify a full featured Bluetooth Low Energy 5 IP with TCRL 2 Specifications. This IP has already been licensed to multiple Tier 1 microcontroller semiconductor companies and will be showcased in the upcoming Bluetooth Asia (May 30th, 31st 2018) in Shenzhen. Meet us at Bluetooth Asia, Click HERE.

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Bluetooth Mesh – the Next Wave of IoT Technology

1. Introduction: The market for Bluetooth low energy devices is expected to reach 1.4 Billion, growing at a CAGR of 34% between 2015 to 2021, as per ABI Research. While investments in Internet-of-Things (IoT) technology are ever increasing, there are many wireless technologies such as Zigbee, Wi-Fi, Bluetooth and Z-wave competing for adoption. The choice of wireless technology depends on the use case and key requirements such as power, latency, reliability, scalability, interoperability,range, cost and bandwidth. The adoption of the Bluetooth low energy (Bluetooth LE) specifications v4.0/v4.2 standards is being driven by adoption in several markets such as the Health and Fitness devices, Beacons, Asset tracking, Home automation, PC Peripherals etc. Bluetooth low energy 5, together with the Bluetooth LE Mesh specifications are set to make Bluetooth the ‘Connectivity of Choice’ in IoT markets such as Connected Home, Commercial Lighting and Industrial Wireless Sensor Network markets.

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Mindtree announces BQB qualification of its Bluetooth Mesh v1.0 Software Stack and EtherMind Bluetooth v5.0 Software Stack & Profiles

Bangalore, India, 28th March 2018 – Mindtree Ltd., has announced the BQB (Bluetooth Qualification Body) qualification of its Bluetooth Mesh v1.0 Software Stack along with its Bluetooth v5.0 Software Stack & Profiles (Declaration ID #D038060). These IPs have already been licensed to major semiconductor companies and will be showcased in the upcoming Bluetooth Asia (May 30th, 31st) in Shenzhen.

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Software-Based GPS Receiver From Galileo Satellite Navigation Now Available on Cadence Tensilica Fusion F1 DSP

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (NASDAQ: CDNS), and Galileo Satellite Navigation, Ltd. (GSN), a developer of multi-system Global Navigation Satellite System (GNSS) products, today announced that the software-based GNSS global positioning system (GPS) receiver from Galileo Satellite Navigation is now available for the Cadence® Tensilica® Fusion F1 DSP.

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WuQi Technologies is the latest licensee of CCww’s NB-IoT UE protocol-stack software

Bournemouth, UK, 22nd February 2018 – Communications Consultants Worldwide Ltd. (CCww), global innovator of 3GPP® technologies, has licensed its NB-IoT protocol-stack software to WuQi Technologies Inc., a leading global developer of highly integrated mixed-signal SoC solutions, and the latest licensee of CCww’s NB-IoT Release 13 UE protocol-stack software. Communications Consultants Worldwide (CCww) is working with WuQi Technologies for the integration of its NB-IoT protocol-stack software onto WuQi Technologies’ highly innovative SoC. This relationship, catalyzed by T2M, is enabling the production of a highly integrated, very low power, NB-IoT SoC chipset targeting IoT Smart City, Smart Home, and wearable applications. NB-IoT (Narrow-Band Internet-of-Things) is the future global solution for low-cost and low-power cellular machine-to-machine connectivity, for use in a broad range of IoT applications including smart cities, logistics, metering, telematics and security. CCww’s NB-IoT Protocol-stack SW is enabling chip and module manufacturers to rapidly enter the market with small-footprint, broadly-tested, stable SW for very low maintenance, 10 year battery-life applications. CCww’s CEO, Richard Carter, said, “NB-IoT is CCww’s latest cellular Protocol-stack SW, in a long history of protocol-stack development. We are excited to be working with WuQi to enable a sector-leading NB-IoT SoC, which will push back boundaries of performance and battery life for the next generation of IoT. We will be showcasing the WuQi / CCww solution along with other products at the Mobile World Congress (Hall-7 stand C17)”. Michael Jiang, VP of Marketing and Sales of WuQi, added, “Working with CCww, the sector’s principal protocol-stack SW developer in the NB-IoT space, is a great honor for us. Our combined focus on the integration process, coupled with CCww’s extensive cellular systems knowledge, has enabled us to achieve an ultra-low power consumption, which will enable customer products with unprecedented performance, efficiency and economy. In the future, we will be jointly upgrading the solution to Release 14 for launch in Q2/18.” Nigel Dixon, CEO of T2M, remarked “Our global relationships in the semiconductor market, coupled with our extensive expertise in wireless semiconductor technology, enabled us to join WuQi with a leading NB-IoT protocol-stack SW and support provider, to take them through integration, certification and mass deployment. We are excited to be enabling companies to build leadership products with our clients’ state-of-the-art technologies.”

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At CES 2018, Global SoC Design Service Provider, Incise announces the appointment of T2M for global marketing, representation & business development

Las Vegas, 10th Jan 2018 – Incise Infotech, a major Indian Semiconductor technology service provider, has signed a commercial marketing agreement with T2M, the world’s largest independent global semiconductor technology provider. Under the terms of the agreement, T2M will act as a global business development partner for Incise Infotech’s semiconductor solutions and services.

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BrainChip Announces Change in Board Membership

SAN FRANCISCO, Dec. 14, 2017 (GLOBE NEWSWIRE) -- BrainChip Holdings Ltd. (“BrainChip” or the “Company”) (ASX:BRN), a leading developer of software and hardware accelerated solutions for advanced artificial intelligence (AI) and machine learning applications, today announced that Peter van der Made, Chief Technology Officer (CTO) and Founder of BrainChip, will be resigning his position as Director on the BrainChip Board effective January 1, 2018. Mr. van der Made will focus exclusively on the development and introduction of Akida, BrainChip’s next generation Neuromorphic System-on-Chip (NSoC) processor unit.

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Broadcom issues patent suit broadside targeting LG, Mediatek and Funai

Broadcom launched a number of patent infringement lawsuits against Asian and US companies this week, in what looks to be the Singapore-based chipmaker’s first concerted assertion campaign since its reconfiguration through merger last year. The litigation is the latest step in an escalating value-creation effort on the part of the new entity. The company’s US unit, Broadcom Corporation, filed six suits in the Central District of California on Monday concerning audiovisual technologies. In court documents seen by IAM, Broadcom states that the accused products targeted by the litigation “are generally semiconductor components… such as, for example, various system-on-a-chip (SoC) and similar processing components and circuits” and “consumer audiovisual products incorporating such SoCs, including… digital televisions, set-top boxes, Blu-ray disc players, DVD players/recorders, DTV/DVD combinations, DTV/Blu-Ray combinations, multimedia streaming players, home theater systems, and other similar audiovisual devices and systems”.

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BrainChip to present at TechKnow Invest Roadshow

SAN FRANCISCO, CA -- (Marketwired) -- 10/12/17 -- BrainChip Holdings Ltd. ("BrainChip" or the "Company") (ASX: BRN), a leading developer of software and hardware accelerated solutions for advanced artificial intelligence (AI) and machine learning applications, is pleased to announce that the Company will be presenting at the TechKnow Invest Roadshow in Melbourne, Australia on 24 October 2017 and Sydney, Australia on 26 October 2017.

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