Press Releases

At CES 2018, Global SoC Design Service Provider, Incise announces the appointment of T2M for global marketing, representation & business development

Las Vegas, 10th Jan 2018 – Incise Infotech, a major Indian Semiconductor technology service provider, has signed a commercial marketing agreement with T2M, the world’s largest independent global semiconductor technology provider. Under the terms of the agreement, T2M will act as a global business development partner for Incise Infotech’s semiconductor solutions and services.

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BrainChip Announces Change in Board Membership

SAN FRANCISCO, Dec. 14, 2017 (GLOBE NEWSWIRE) -- BrainChip Holdings Ltd. (“BrainChip” or the “Company”) (ASX:BRN), a leading developer of software and hardware accelerated solutions for advanced artificial intelligence (AI) and machine learning applications, today announced that Peter van der Made, Chief Technology Officer (CTO) and Founder of BrainChip, will be resigning his position as Director on the BrainChip Board effective January 1, 2018. Mr. van der Made will focus exclusively on the development and introduction of Akida, BrainChip’s next generation Neuromorphic System-on-Chip (NSoC) processor unit.

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Broadcom issues patent suit broadside targeting LG, Mediatek and Funai

Broadcom launched a number of patent infringement lawsuits against Asian and US companies this week, in what looks to be the Singapore-based chipmaker’s first concerted assertion campaign since its reconfiguration through merger last year. The litigation is the latest step in an escalating value-creation effort on the part of the new entity. The company’s US unit, Broadcom Corporation, filed six suits in the Central District of California on Monday concerning audiovisual technologies. In court documents seen by IAM, Broadcom states that the accused products targeted by the litigation “are generally semiconductor components… such as, for example, various system-on-a-chip (SoC) and similar processing components and circuits” and “consumer audiovisual products incorporating such SoCs, including… digital televisions, set-top boxes, Blu-ray disc players, DVD players/recorders, DTV/DVD combinations, DTV/Blu-Ray combinations, multimedia streaming players, home theater systems, and other similar audiovisual devices and systems”.

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BrainChip to present at TechKnow Invest Roadshow

SAN FRANCISCO, CA -- (Marketwired) -- 10/12/17 -- BrainChip Holdings Ltd. ("BrainChip" or the "Company") (ASX: BRN), a leading developer of software and hardware accelerated solutions for advanced artificial intelligence (AI) and machine learning applications, is pleased to announce that the Company will be presenting at the TechKnow Invest Roadshow in Melbourne, Australia on 24 October 2017 and Sydney, Australia on 26 October 2017.

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CCww’s NB-IOT R13 Protocol-stack software is licensed by a leading IoT Chip developer

Bournemouth, UK, 25th Sep 2017 – Communications Consultants Worldwide Ltd. (CCww), global innovator of 3GPP technologies has licensed its NB-IoT protocol-stack software to a leading Shanghai and Silicon Valley based developer of highly integrated and unique mixed-signal SoC solutions. This relationship, catalyzed by T2M, will enable the production of the highly integrated NB-IoT SoC chipset targeting IoT, Logistics, Smart metering, Health and Fitness markets. NB-IoT (Narrow-Band Internet-of-Things) is the future global solution to low-cost and low-power for cellular machine-to-machine connectivity, for use in metering, telematics, security… where very low maintenance and up to 10-years battery-life are required. CCww’s NB-IoT R13 Protocol-stack SW is enabling chip manufacturers and module manufacturers to rapidly enter the market with small-footprint, broadly-tested, and stable SW. R14 is under development, and will be available in 2Q18.

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Telink Semiconductor to demonstrate smart lighting, smart home, retail and logistics applications at Bluetooth Asia 2017 in Shenzhen

Shanghai, China, 18 September 2017 – Telink Semiconductor, developer of highly integrated low power radio-frequency and mixed signal system chips for internet of things (IoT) applications, will be demonstrating a number of applications for smart lighting, smart home, retail and logistics based on its devices at the Bluetooth Asia 2017 conference taking place in Shenzhen, China on 26-27 September 2017.

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BrainChip Studio Awarded New Product of the Year for Video Analytics by Security Today’s Panel of Independent Judges

ALISO VIEJO, CA -- (Marketwired) -- 08/22/17 -- BrainChip Holdings Ltd. (ASX: BRN) ("BrainChip" or "the Company"), a leading developer of software and hardware accelerated solutions for advanced artificial intelligence (AI) and machine learning applications, has won the Security Today's New Product of the Year Award 2017 in the Video Analytics category for its BrainChip Studio software suite. The award honors the outstanding products considered to be particularly noteworthy in their ability to improve security. The trophy will be accepted by BrainChip during the ASIS International 63rd Annual Seminar and Exhibits, September 25th - 28th, Dallas, Texas.

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Telink Semiconductor and Unitec Semicondutores join forces to address IoT market in Latin America

Ribeirão das Neves, Brazil, 20 March - Telink Semiconductor, developer of highly integrated low power chips for Internet of Things (IoT) applications, and Unitec Semicondutores, the largest and most modern semiconductor fab in the southern hemisphere, have signed an MOU for strategic business and technical collaboration to expand into markets such as Smart Lighting, Home Networking, Agriculture etc. in Brazil and Latin America. The partnership, established by T2M, is designed to take various forms including direct wafer supply, IP licensing, and custom product development.

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Telink Semiconductor’s RF system on chip (SoC) passes ZigBee 3.0 certification tests using DSR’s wireless software stack

Shanghai, China, 5 January 2017 – Telink Semiconductor, developer of highly integrated low power chips for Internet of Things (IoT) applications, has announced that its ZigBee RF SoC has passed the ZigBee compliant platform tests based on the latest ZigBee stack specification using DSR Corporation’s ZBOSS 3.0 ZigBee 3.0 wireless stack, and thus can start to provide a ZigBee 3.0 SDK (software development kit) to its customers.

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