Press Releases

物奇科技成为CCww NB-IoT UE协议栈 软件的最新授权商

2018年2月22日,在英国伯恩茅斯,全球领先的3GPP® 技术创新者 Communications Consultants Worldwide Ltd(CCww)将其NB-IoT UE 协议栈软件授权给全球领先的物联网通信芯片开发商——物奇科技有限公 司。 物奇科技是CCww的NB-IoT Release 13 UE协议栈软件的最新授权合作伙 伴。通过T2M的引进,CCww正在与物奇科技合作将其NB-IoT UE协议栈 软件集成到物奇科技市场领先的芯片产品上。物奇科技的NB-IoT芯片组具 有高集成度和极低功耗的优势,适合物联网、智慧城市、智能家居和可穿 戴产品等许多应用场景。 NB-IoT(窄带物联网)是低成本和低功耗M2M的未来全球解决方案标 准,适用于广泛的物联网应用,包括智慧城市、物流、计量、远程信息处 理和安全。CCww的NB-IoT协议栈软件是经过广泛测试的稳定软件,使得 芯片和模块制造商能够以小尺寸、低维护成本的产品快速进入市场,并适 用于要求电池使用寿命长达10年的应用场景。 CCww的首席执行官理Richard Carter说:“CCww在协议栈开发方面有着 悠久的历史。NB-IoT UE 协议栈软件是CCww最新的移动通信软件。我们 很高兴能够与物奇科技合作,推出业界领先的NB-IoT解决方案。这将推动 下一代物联网产品在性能和电池寿命上的幅幅提高。我们将在世界移动通 信大会(Hall-7展位C17)上展示物奇科技/ CCww 解决方案及其产品。“ 物奇科技市场和销售副总裁姜中华补充道:“非常高兴与NB-IoT领域的主 要协议栈软件开发商CCww合作。CCww拥有广泛的移动通信系统相关的 知识和经验。通过把CCww的软件集成在物奇芯片上并与CCww共同努力 将其优化,我们的软件只需占用很小的存储空间,整个芯片组实现了超低 功耗。这使得我们的客户能够设计实现前所未有的高性能、低功耗和低成 本的智能物联网产品。在2018年第2季度前,CCww将与物奇合作将NBIoT UE协议栈软件升级并支持3GPP Release 14。” T2M首席执行官Nigel Dixon表示:“我们在半导体市场上与全球合作伙伴 的关系,加上我们在无线半导体技术方面的丰富专业知识,使我们能够促 成物奇科技与领先的NB-IoT协议栈软件和技术支持提供商CCww的合作。 我们很高兴能够帮助公司利用我们客户的最新技术构建领先产品。” 关于物奇科技 物奇是一家私人投资创立的芯片和软件公司,总部位于中国重庆。物奇为 物联网、智能电网、智能家居、医疗健康以及其他市场提供高度集成和创 新的芯片和系统解决方案。物奇能够使其客户和合作伙伴设计并生产前所 未有的高性能、低功耗和低成本的产品。欲了解更多信息,请访问: http://www.wuqi-tech.com 关于CCww CCWE是ETSI的正式成员,自2000年以来一直致力于开发嵌入式3GPP® 协议栈软件,CCww为全球的移动通信客户提供软件产品授权和技术支持 服务;超过30亿个设备使用了CCww的技术。CCww最新的产品是3GPP Release 13/14 NB-IoT UE协议栈,CCww提供广泛的集成,一致性测试 和技术支持服务。为进一步增加授权合作伙伴的市场覆盖面,CCww还计 划于2018年下半年对其Cat M1软件进行升级。欲了解更多信息,请访问 :www.ccww.co.uk 关于T2M T2M是全球最大的独立全球半导体技术提供商,提供复杂的IP、软件、 KGD和颠覆性技术。加速客户物联网、无线、消费类和汽车电子设备的设 计和生产。在世界各地的所有关键区域都有我们的高级管理团队成员,这 使得我们可以提供本地化的服务,使所有的客户都可以快速方便的了解业 界领先公司,技术和产品。欲了解更多信息,请访问:www.t-2-m.com

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At CES 2018, Global SoC Design Service Provider, Incise announces the appointment of T2M for global marketing, representation & business development

Las Vegas, 10th Jan 2018 – Incise Infotech, a major Indian Semiconductor technology service provider, has signed a commercial marketing agreement with T2M, the world’s largest independent global semiconductor technology provider. Under the terms of the agreement, T2M will act as a global business development partner for Incise Infotech’s semiconductor solutions and services.

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Broadcom issues patent suit broadside targeting LG, Mediatek and Funai

Broadcom launched a number of patent infringement lawsuits against Asian and US companies this week, in what looks to be the Singapore-based chipmaker’s first concerted assertion campaign since its reconfiguration through merger last year. The litigation is the latest step in an escalating value-creation effort on the part of the new entity. The company’s US unit, Broadcom Corporation, filed six suits in the Central District of California on Monday concerning audiovisual technologies. In court documents seen by IAM, Broadcom states that the accused products targeted by the litigation “are generally semiconductor components… such as, for example, various system-on-a-chip (SoC) and similar processing components and circuits” and “consumer audiovisual products incorporating such SoCs, including… digital televisions, set-top boxes, Blu-ray disc players, DVD players/recorders, DTV/DVD combinations, DTV/Blu-Ray combinations, multimedia streaming players, home theater systems, and other similar audiovisual devices and systems”. The defendants are LG Electronics, Mediatek and its subsidiary MStar Semiconductor, Japanese manufacturer Funai, US chipmaker Sigma Design and US consumer electronics company Vizio, which is currently the subject of a $2 billion takeover bid from China’s LeEco. The patents being enforced by Broadcom include: • US patent 7,310,104 – ‘Graphics display system with anti-flutter filtering and vertical scaling feature’ (only asserted against Sigma Design) • US patent 7,342,967 – ‘System and method for enhancing performance of personal video recording (PVR) functions on hits digital video streams’ (not asserted against Funai) • US patent 7,590,059 – ‘Multistandard video decoder’ • US patent 8,068,171 – ‘High speed for digital video’ (not asserted against Mediatek) • US patent 8,284,844 – ‘Video decoding system supporting multiple standards’ Each of the patents was originally assigned to Broadcom Corporation before it was acquired by US-Singaporean semiconductor company Avago Technologies in a $37 billion merger deal announced in May 2015, which saw the combined entity adopt the Broadcom brand. In its filings with the Central California court, Broadcom provides some eye-catching detail on its R&D and IP holdings. The company claims that from 2015 to 2016, it spent $3.7 billion on product-related R&D, with $2.7 billion of that being spent in 2016 alone. Prior to Avago’s buyout, US-based Broadcom Corporation spent between $2.3 billion and $2.5 billion in the three-year period ending 2014. The filing documents further claim that as of the end of October last year, post-merger Broadcom as a whole held approximately 27,640 patents and 3,020 pending applications worldwide, with its R&D activities resulting in around 350 patent applications each year on average. By the time the Avago-Broadcom merger was reported as having completed in February 2016, the company had become the owner of one of the world’s largest patent portfolios, easily slotting in among the top 15 holders of US-issued assets. In 2016, the US Intellectual Property Owners Association identified Broadcom (listed as Avago) as the second biggest gainer in terms of US patent grants, its 144% year-on-year growth putting it just behind fellow chipmaker NXP’s 148% increase. It would seem that there has been impetus from within Broadcom to extract more value from the substantial portfolio it now has on its hands. One notable event in this regard was its assignment of several US patents to Xiaomi in late 2015, which represented the Chinese start-up’s first known straight purchase of third-party patents. In June last year, it sued Sony for alleged infringement of numerous patents, some of which Avago had acquired through its takeovers of LSI and Broadcom Corporation; this was followed by a suit targeting Amazon and its Web Services business in September. The litigation launched in California this week looks like it represents another step in this direction.

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CCww公司NB-IoT R13 Protocol-stack software得到了全球领先的物联网(IoT)芯片开发商的授权许可

2017年9月25日,英国·伯恩茅斯 – 世界领先的3GPP技术创新开发商——Communications Consultants Worldwide Ltd.(CCww)已将其NB-IoT protocol-stack software授权给了一家总部位于上海、拥有高知名且高度集成的混合信号系统芯片(SoC)解决方案开发商。这种在与T2M公司合作促进下的关系能够有针对性地就物联网、物流、智能计量、健康领域的高集成NB-IoT系统芯片组发展带来积极影响。

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Telink Semiconductor to demonstrate smart lighting, smart home, retail and logistics applications at Bluetooth Asia 2017 in Shenzhen

Shanghai, China, 18 September 2017 – Telink Semiconductor, developer of highly integrated low power radio-frequency and mixed signal system chips for internet of things (IoT) applications, will be demonstrating a number of applications for smart lighting, smart home, retail and logistics based on its devices at the Bluetooth Asia 2017 conference taking place in Shenzhen, China on 26-27 September 2017.

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BrainChip Studio Awarded New Product of the Year for Video Analytics by Security Today’s Panel of Independent Judges

ALISO VIEJO, CA -- (Marketwired) -- 08/22/17 -- BrainChip Holdings Ltd. (ASX: BRN) ("BrainChip" or "the Company"), a leading developer of software and hardware accelerated solutions for advanced artificial intelligence (AI) and machine learning applications, has won the Security Today's New Product of the Year Award 2017 in the Video Analytics category for its BrainChip Studio software suite. The award honors the outstanding products considered to be particularly noteworthy in their ability to improve security. The trophy will be accepted by BrainChip during the ASIS International 63rd Annual Seminar and Exhibits, September 25th - 28th, Dallas, Texas.

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Telink Semiconductor and Unitec Semicondutores join forces to address IoT market in Latin America

Ribeirão das Neves, Brazil, 20 March - Telink Semiconductor, developer of highly integrated low power chips for Internet of Things (IoT) applications, and Unitec Semicondutores, the largest and most modern semiconductor fab in the southern hemisphere, have signed an MOU for strategic business and technical collaboration to expand into markets such as Smart Lighting, Home Networking, Agriculture etc. in Brazil and Latin America. The partnership, established by T2M, is designed to take various forms including direct wafer supply, IP licensing, and custom product development.

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