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SoC White Box IPs

BLE 5 LL, PS SW, Profiles IP

개요특징Datasheet 요청하기

Description

BlueLitE is a Bluetooth core certified by BT SIG to meet the specifications version 5 (Bluetooth low energy) for single mode.

The BlueLitE product line has two component IPs. The BlueLitE-SP (Stack and Profiles) and the BlueLitE-LP (Link layer and Physical layer)

BlueLitE Link Layer

The BlueLitE product line has two component IPs. The BlueLitE-SP (Stack and Profiles) and the BlueLitE-LP (Link layer and Physical layer)

The link layer is a hardware-firmware implementation. While the time critical protocol procedures are handled in the hardware, the firmware implements the link layer control protocol (LLCP), Security and host command and event handling.

The physical layer is a digital hardware implementation and performs the GFSK modulation & demodulation and provides features for receive AGC and RSSI measurements.

Pre-integrated with major RF IPs from CSEM, AURA, Catina, etc.

BlueLitE SW Stack & Profiles

BlueLitE-SP is the stack and profile solution for single mode Bluetooth low energy Specification. This consists of LE-HCI, LE-L2CAP, LE-SM, LE-GAP, GATT, ATT and a suite of all profiles adopted by SIG. The BlueLitE-SP is designed to be portable on variety of platforms including 8 bit microcontrollers with minimal system resources.

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Features

  • Implements Link layer and physical layer of LE controller specification
  • Supports all mandatory and optional features
  • Supports all device roles and states
  • Architected for very low power and low memory footprint
  • Integrated Power Management
  • Firmware portable for 8/16/32-bit microcontrollers
  • Deliverables

  • Source Code of Transport Abstraction Layer and Operating System Abstraction Layer
  • Firmware source code
  • Technical Documnetation
  • OS and MCU abstraction layers for portability to any SoC platform
  • Support for multiple processor bus and flexible RF Interface
  • BLE 5 BQB qualified

밑의 서식을 작성해주십시오

T2M의 높은 퀄리티의 사전실증된 아날로그/혼합 시그널, RF, Digital and SW 시스템 해결책은 통신, 소비자와 컴퓨터 제품(IoT, Wearables, 핸드폰, 타블랫, M2M, RCU, set-top boxes, TV, 디비디 플레이어, PC 칩셋등)에 중요한 빌딩 블록으로 사용됩니다. IP는 소비자의 구체적인 요구조건에 따라fab/node 이식이나 전매 특징들을 수정할수 있습니다.