Press Releases

MIPI RFFE (RF Front-End Control Interface) v3.0 Master and Slave Controller IP Cores for ultimate control of your RF Front-end Cellular or Base station SoC’s with Low Power Consumption and Reduced Latencies

T2MIP, the global independent semiconductor IP Cores provider & Technology experts, is pleased to announce the immediate availability of its partner’s MIPI RFFE v3.0 Master and Slave Controller IP Cores which are mature, proven and in production chips with High performance and low power consumption support.

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Wi-Fi 802.11 ax + Bluetooth LE v5.3 + 15.4 2.4GHz RF Transceiver IP Core in 22nm ULL, available for immediate licensing for IoT applications.

T2MIP, the global independent semiconductor IP Cores provider & Technology experts, is pleased to announce the immediate availability of its’ partners Wi-Fi 802.11 ax + Bluetooth LE v5.3 + 15.4 2.4GHz RF Transceiver IP Core with integrated PA in 22nm ULL is available for immediate licensing for the development of ultra-low power IoT (Internet of Things) connectivity chipsets. The RF IP core is fully compliant to WiFi IEEE 802.11 ax standard, IEE 802.15.4 standard & the Bluetooth LE (BLE) v5.3 standard, integrating all functional blocks including PA, transmitter, receiver, Frac-N frequency synthesizer, PMU & Interfaces. The RF IP Core is optimized for ultra-low power and very small die area for low-cost / low-power IoT applications such as wearables, logistics, smart home, smart lighting, sensors, appliances etc.

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10/100/1000 Gigabit Ethernet PHY IP Cores including MAC Controller is available for immediate licensing for your advanced SOC to drive Data faster and farther

T2MIP, the global independent semiconductor IP Cores provider & Technology experts, is pleased to announce the immediate availability of its’ partners GbE (10-100-1000 Base-T) PHY IP Cores which is compliant to IEEE 802.3-2008, IEEE 802.3az and IEEE 802.3u/ab which is silicon proven in major Fabs and Nodes and can also be ported to required Fab and Node.

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MIPI UFS v3.1 Ctrl., MIPI UniPro v1.8 Ctrl. & MIPI M-PHY v4.1 IP Cores in 12nm & 28nm available for immediate licensing for high performance serial interface applications

T2MIP, The global independent semiconductor IP Cores provider & Technology experts, is pleased to announce the immediate availability of its’ partners MIPI UFS v3.1 Controller IP Core, MIPI UniPro v1.8 Controller IP Core and MIPI M-PHY v4.1 IP Core silicon proven 12nm FinFET Compact (FFC) and 28nm High-Performance Computing Plus (HPC+) semiconductor processes. The IP Cores are compliant with the latest  JEDEC UFS v3.1  specification,   M-PHY v4.1  Specification and   UniPro v1.8  Specification.

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DVB-S2X/S2/S Demodulator IP Core licensed to a Major Chinese Semiconductor company for integration into an 8K TV SOC

T2MIP, the global independent semiconductor IP Cores provider and Technology experts, is pleased to announce the licensing of its partners mass production proven DVB-S2X/S2/S Narrowband Demodulator IP Core to a leading Chinese Semiconductor company for integration into its 8K TV Chipset. This DVB-S2X/S2/S IP Core is extracted from a high-volume mass production STB SoC used in high-end satellite broadband, hybrid broadband-broadcast, and Smart TV applications. It implements two high-symbol rate (HSR) demodulators and up to eight narrow band demodulators and provides full support for network clock recovery (NCR). The IP Core optimizes the use of Ka-band and multi-spot beam technology carried by the latest high-throughput satellites (HTSs) by enabling single-carrier usage of these transponders providing a 30% increase in channel efficiency over multicarrier solutions.

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DDR Combo PHY & Controller IP Core Silicon Proven in 12nm & 28nm available for immediate licensing.

T2MIP, The global independent semiconductor IP Cores provider & Technology experts, is pleased to announce the immediate availability of its’ partners DDR combo PHY & Controller IP Core silicon proven 12nm FinFET Compact (FFC) and 28nm High-Performance Computing Plus (HPC+) which supports DRAM types DDR4/DDR3L/LPDDR4 for your high performance Storage and Memory SOC Designs.

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14nm FinFET production USB3.0/PCIe3.0/SATA3.0/SGMII Combo PHY IP Core, available for immediate licencing

T2M-IP, The global independent semiconductor IP Cores & Technology experts, are pleased to announce the immediate availability of its’ partners silicon proven 14nm FinFET USB3.0/PCIe/SATA/SGMII combo PHY IP Core for High Performance SOC Designs. The 14nm FinFET Phy IP Core is designed for chips implementing high bandwidth data communication (support USB3, PCIe3 and SATA3) for applications such as 5G, AI (Artificial Intelligence), IoT (Internet of Things), automotive electronics and consumer electronics.

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DisplayPort (DP, eDP) v1.4 Transmitter & Receiver PHY & Controller IP Cores for advanced SOC supporting 8K resolutions!

T2M-IP, The global independent semiconductor IP Cores & Technology experts, are pleased to announce the immediate availability of its’ partners VESA-compliant DisplayPort v1.4 Transmitter & Receiver PHY and Controller IP Cores which are silicon proven in major Fabs and Nodes that can enable resolutions upto 8K and servicing a wide variety of applications such as consumer, industrial, medical, broadcast etc…

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MIPI CSI 3, DSI 2 Tx & Rx Advanced Controller & PHY IP Cores available in major Fabs & Nodes for SOC Designs for Imaging and Display Applications

T2M-IP The global independent semiconductor IP Cores & Technology provider, is pleased to announce the immediate availability of it’s partners advanced MIPI CSI, DSI Tx & Rx Controller & PHY IP Cores which are silicon proven and fully compliant with MIPI CSI v3.x Standard & MIPI DSI v2.x Standard integrated with matching MIPI D-PHYs & MIPI C-PHYs.

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BLE/15.4 2.4GHz+Sub-GHz Multi-Protocol RF Transceiver Phy KGD & IP for adding wireless Connectivity to “any MCU/SoC”

T2M-IP, the global independent Semiconductor IP Cores, SW & Technology provider, is pleased to announce the availability of a BLE/15.4 2.4GHz + Sub-GHz Multi-Protocol RF Transceiver Phy KGD & IP based on 40nm ULP technology for custom system-in-package (SiP) or multi-chip package (MCP) solutions, or SoC development, instantly adding “Wireless connectivity” to any SoC with an embedded CPU.

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