SAN FRANCISCO--(BUSINESS WIRE)--
SAN FRANCISCO--(BUSINESS WIRE)--
SAN FRANCISCO (GLOBE NEWSWIRE) -- Louis DiNardo, CEO of BrainChip, a leading provider of ultra-low power, high performance edge AI technology has been accepted into Forbes Technology Council, an invitation-only community for world-class CIOs, CTOs, and technology executives.
Neuchatel, 24 September 2019 – CSEM, a leader in low-power RFIC design and embedded systems, announced today at GLOBALFOUNDRIES (GF) annual Global Technology Conference (GTC) that CSEM is developing ultra-low power Bluetooth Low Energy® (BLE), CMOS radar mmWave IP and embedded machine-learning accelerators on GLOBALFOUNDRIES (GF) 22nm FD-SOI (22FDX®) platform.
The combination of GF’s 22FDX and CSEM’s “IcyTRX” dual mode Bluetooth Low Energy and Bluetooth classic RF is expected to achieve 50% lower power and 50% lower area than their existing GF 55nm BLE RF IP solution. Moreover, CSEM’s patented machine learning accelerator, called Visage, is expected to achieve more than 60% power savings and 80% area savings with 22FDX compared to 55nm, allowing for true AI edge-processing with a dedicated RISC-V processor.
Munich, Germany, 28 Septemeber 2018 - T2M, the world’s largest independent global semiconductor IP provider, announced the launch of its first low-power digital image processor IP designed to perform advanced image correction and enhancement, resulting in superior image quality in today’s multi-megapixel cameras. Its’ built-in high-level features include face tracking, video stabilization and a smooth digital zoom, bringing an outstanding user experience to camera systems.
Company introduces the architecture of the first in a new breed of neural network acceleration SoCs that puts artificial intelligence at the edge and the enterprise
Lekha Wireless is pleased to invite you to the India ASEAN ICT Expo 2018 in Vietnam, to discuss regarding collaboration, partnership in cutting-edge 5G-NR, eNB and NB-IOT solutions.
T2M and Lekha Wireless, are pleased to invite you to visit their booth at #MWCA18, to discuss regarding collaboration, partnership in cutting-edge 5G-NR, eNB and NB-IOT solutions.
Munich, Germany: Lekha Wireless, the leading wireless communications and embedded systems technology company, has signed an agreement with T2M, the world’s largest independent global semiconductor IP provider, to act as a global representative and business development partner of Lekha Wireless’ IP and technology solutions.
Munich, June 20, 2018 – T2M, the world’s largest independent global semiconductor IP technology provider today announced that they will be showcasing their latest Cellular and Low Power Wireless IoT technology IP at MWC Shanghai on 27, 28 and 29th June at the Shanghai New International Expo Centre.
Mobile World Congress Shanghai is the must-attend industry event in Asia. With over 60,000 attendees, the event represents the entire mobile and technology eco-system in areas of: Artificial Intelligence, Automotive, Devices and IoT.
At the show, you can experience demos and discuss with T2M experts on our cutting-edge IP:
Cellular IOT SoC IP
NB-IOT/Cat M1 Phy & PS SW
NB-IOT RF IP
GNSS SW IP (DSP/CPU)
GNSS RF IP & Rx
GSM Phy & PS SW
Low Power Wireless Connectivity SoC IP Technology (BQB & ZigBee Alliance Certified)
BLE v5 / 15.4 Digital LL & MAC
BLE v5 / 15.4 RF IP (0.5mm2)
BLE v5 SW Stack & Profiles
Bluetooth Mesh v1.0 SW
ZigBee v3 SW Stack & Profiles
When: 27 – 29 June, 2018
Location: Shanghai New International Expo Centre
To Book a Meeting, Click here.
T2M is the world's largest independent global semiconductor technology provider, supplying complex IP, software, KGD and disruptive technologies enabling accelerated production of IoT, wireless, consumer and automotive electronics devices. Located in all key tech clusters around the world, our senior management team provides local access to leadership companies and technology. For more information, please visit www.t-2-m.com
Munich, May 16, 2018 – T2M, the world’s largest independent global semiconductor technology provider today announced that, Mindtree, will be showcasing their customer proven BQB-qualified Bluetooth Mesh v1.0 software and Bluetooth Low Energy 5.0 Modem, Digital Link Layer, Protocol Stack SW and Profiles IP at Bluetooth Asia 2018 on 30, 31 May at Shenzhen Convention & Exhibition Centre, Booth #34.