Production Proven, Complex Semiconductor IP Cores

IP Cores


T2M Bluetooth BLE v5.0 RF KGD & IP

BLE v5.0 RF KGD & IP

Description and Features

A complete RF Transceiver (IP/die) for adding Bluetooth Low Energy v5.2 (2.4GHz) capability to any SoC with embedded MCU via a standard SPI interface.

Integrated BLE Link Layer enables data rates of 2Mbps for High Speed Bluetooth connectivity & Long Range for connection range of ~100 meters.

Standard SPI interface plus chip select & packet sync pins for interfacing to an MCU or SOC and accessing an integrated AES engine for data encryption/decryption. No external RAM, ROM or Flash is not required.

Low cost & simple upgrade to any embedded MCU system.

Availability

  • Packaged RF Chip

  • Known Good Die (KGD): Stack with Microcontroller in SIP

  • RF IP: GDSII, Technology Transfer

  • Production Transfer

  • Turnkey ASIC: based on core Bluetooth IP, Derivatives of Bluetooth IP

 ble-5-rf-kgd                       kgd-die 

Features
  • 2.4GHz RF Bluetooth Low Energy v5.2 Phy
  • BQB Bluetooth® 5 Low Energy Certified: RF PHY Component, Link Layer, Protocol Stack SW, MESH SW\
  • Data Rate Supported: 2Mbps & 1Mbps
  • Integrated functionality: RF Transceiver + Modem Phy, CRC & AES-CCM HW security engine, Integrated DC-DC and LDO regulator, 16MHz / 32MHz XTAL, 32KHz XTAL
  • High TX Power: +10dBm
  • High RX sensitivity: -97dBm (1Mb/s PHY BER=0.1%)
  • Very Low Power Consumption: Standby & Deep Sleep functions
  • TSMC55 ULP