Events
Latest IP
NEWS
- Announcing superfast, HD Audio & Video through HDMI 2.0 Tx & Rx PHY & Controller IP Cores uncompressed data transfer in 28HPC+ and 12FFC
- eDisplay Port / Display Port v1.4 Tx PHY and Controller IP Cores is available in 40nm ULP and 12nm FFC for your picture perfect UHD, 8K, 4K Display Applications
- Introducing JESD204B Controllers and matching PHYs for high-speed, high-resolution device interconnection for high density systems!
- Bluetooth Dual Mode v5.3 RF Transceiver IP Cores in 40nm ULP is available for immediate licensing for Audio SoC applications.
- USB 3.0/ PCIe 3.0/ SATA 3.0 Combo PHY IP Cores for High Bandwidth, Low Power data communication in PCs, Mobiles, SSDs, and other Multimedia Devices.
- SD 5.1/eMMC 5.1 Host and Device Controllers with Matching PHYs for all kind of Portable Memory Storage Devices, making it easy to integrate a wide range of Applications in your products
- ISDB-S3 Demodulator IP Core is now available for licensing to STB & TV SoC Manufacturers
- MIPI RFFE (RF Front-End Control Interface) v3.0 Master and Slave Controller IP Cores for ultimate control of your RF Front-end Cellular or Base station SoC’s with Low Power Consumption and Reduced Latencies
- Wi-Fi 802.11 ax + Bluetooth LE v5.3 + 15.4 2.4GHz RF Transceiver IP Core in 22nm ULL, available for immediate licensing for IoT applications.
- 10/100/1000 Gigabit Ethernet PHY IP Cores including MAC Controller is available for immediate licensing for your advanced SOC to drive Data faster and farther
As the world’s largest independent global semiconductor IP provider, T2M delivers complex system level semiconductor IP, KGD, Software and Disruptive Technologies enabling accelerated SoC development. Our range of high quality silicon-verified, RF, Analog, Digital, Software and System Solutions, are used as critical building blocks for communications, consumer and computer products including IoT, Wearables, Cellular, M2M, RCU, Set-Top Boxes, TVs, DVD players and PC chipsets.
T2M’s unique SoC White Box IPs are the design database of Tier 1 semiconductor companies’ production chips, supplied for technology transfer as source code and KGD/Die enabling immediate market entry.
