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- USB 4.0, USB 3.2, USB 3.0, USB 2.0 Silicon Proven PHYs in TSMC, UMC & SMIC Foundries available from T2MIP
- Dual Mode Bluetooth v5.2 SW Link Layer, Protocol Stack SW, Profiles licensed for ultra-low power 22nm True Wireless (TWS) Earbuds SoC
- Kakao Enterprise Partners with DSP Concepts to Raise the Bar for Voice Performance in its Mini Hexa Smart Speaker
- DSP Concepts and Cambridge Consultants work to accelerate audio and voice innovation
- More HDMI 2.1 Enabled Products Reach The Market Bringing Advanced Consumer Entertainment Features To a Wide Audience
- DSP Concepts and Cambridge Consultants work to accelerate audio and voice innovation
- Bluetooth SIG to Begin Qualifying Products Using LC3 Codec
- PCIe Gen5 & PCIe Gen4 Phy IP available in TSMC 12FFC!
- Bluetooth RF Transceiver Phy KGD for adding Bluetooth Connectivity to “any SoC”
- Audio Weaver + TalkTo reference design now available on Qualcomm® QCS400 series of audio System-on-Chips (SoCs)
As the world’s largest independent global semiconductor IP provider, T2M delivers complex system level semiconductor IP, KGD, Software and Disruptive Technologies enabling accelerated SoC development. Our range of high quality silicon-verified, RF, Analog, Digital, Software and System Solutions, are used as critical building blocks for communications, consumer and computer products including IoT, Wearables, Cellular, M2M, RCU, Set-Top Boxes, TVs, DVD players and PC chipsets.
T2M’s unique SoC White Box IPs are the design database of Tier 1 semiconductor companies’ production chips, supplied for technology transfer as source code and KGD/Die enabling immediate market entry.