This Software and Silicon IP solutions, feature Bluetooth v5.4 capabilities including a certified Link-layer controller, Digital PHY, Stack & Profiles.
Endorsed by the Bluetooth Special Interest Group (SIG) for meeting version 5.3 specifications in Bluetooth low energy single mode, our v5.3 (Milan) Specifications enable Audio-over-BLE functionality, incorporating core Protocol Stack and Link Layer specifications.
In collaboration with Bluetooth SIG Working Groups, we're defining Generic Audio Middleware Specifications, exclusively designed to enable Audio-over-BLE. Our IP seamlessly integrates with third-party radios of leading Tier-1 customers, ensuring unparalleled compatibility and ease of adoption.
Implements Link layer and physical layer of LE controller specification
v5.1 Madrid Features: DF - AoA/AoD
Firmware portable for 8/16/32-bit microcontrollers
Support for multiple processor bus and flexible RF
Interoperability tested at last few UPFs
Optimized SBC, mSBC and LC3 codecs
Platform and OS agnostic
OS and MCU abstraction layers for portability to any SoC platform
HW/FW co-design
Supports all mandatory and optional features
Supports all device roles and states
Architected for very low power and low footprint
Integrated Power Management Interface
BQB qualified
Deliverables·
Source Code of Transport Abstraction Layer and Operating System Abstraction Layer
Firmware source code
Technical Documentation
Support for multiple processor bus and flexible RF Interface
BT SIG has licensed our stack for integration into the PTS -Test tool. This ensures that every product will need to prove interoperability against the partner's stack for the purpose of qualification
Proven in all UnPlugFests
Tested for interoperability with more than 200 smart phone models
TWS Earbuds
Bluetooth Headphones
Smart Speakers
