Production Proven, Complex Semiconductor IP Cores

Semiconductor IP Cores


T2M Bluetooth BLE 5.2 RF Phy IP / Die (KGD) / Chip

BLE 5.2 RF Phy IP / Die (KGD) / Chip

Description

RF Transceiver (IP/die) for adding Bluetooth Low Energy v5.2 (2.4GHz) capability to any SoC with embedded MCU via a standard SPI interface. Integrated BLE Link Layer enables data rates of 2Mbps for High Speed Bluetooth connectivity & Long Range for connection range of ~100 meters. Standard SPI interface plus chip select & packet sync pins for interfacing to an MCU or SOC and accessing an integrated AES engine for data encryption/decryption. No external RAM, ROM or Flash is not required. Low cost & simple upgrade to any embedded MCU system.

 ble-5-rf-kgd                       

 

 

Features
  • 2.4GHz RF Bluetooth Low Energy v5.2 Phy

  • BQB Bluetooth® 5 Low Energy Certified

  • RF PHY Component

  • Link Layer

  • Protocol Stack SW

  • MESH SW

  • Data Rate Supported:

  • 2Mbps & 1Mbps

  •  Integrated functionality:

  • RF Transceiver + Modem Phy

  • CRC & AES-CCM HW security engine

  •  Integrated DC-DC and LDO regulator

  • 16MHz / 32MHz XTAL

  • 32KHz XTAL

  • High TX Power

  • +10dBm

  • High RX sensitivity:

  • 97dBm (1Mb/s PHY BER=0.1%)

  • Very Low Power Consumption

  • Standby & Deep Sleep functions

  • PMU for power-saving states

  • TSMC55 ULP

Availability

  •  Packaged RF Chip

  • Known Good Die (KGD)

  • Stack with Microcontroller in SIP

  • RF IP

  • GDSII

  • Technology Transfer

  • Production Transfer

  • Turnkey ASIC

  • based on core Bluetooth IP

  • Derivatives of Bluetooth IP