Production Proven, Complex Semiconductor IP Cores

IP Cores

T2M Bluetooth BLE v5.3 RF IP in TSMC 22nm ULP

BLE v5.3 RF IP in TSMC 22nm ULP

Description and Features

Ultra-Low-Power BLE RF IP is designed to support 2.4 GHz standards like Bluetooth Classic (BR/EDR), 802.15.4 PHY Layer (e.g., ZigBee), ANT, and proprietary standards. This BLE RF IP in TSMC 22nm delivers the lowest power consumption together with state-of-the-art performances (sensitivity, interference rejection) at a minimal cost. The IPs integrated LDOs, fully programmable modem and interfaces are optimized for easy integration into SoCs and compatible with leading BT Controllers.

Our IP is targeted for AIoT /Bluetooth Audio (TWS Earbuds, headsets, etc.) /Hearables /Smart Watches/ Hearing Aids, etc.


  • Smallest Analog die area.
  • Tx Output power +12dBm, Rx Sensitivity -98dBm.
  • Compatible with leading Link Layer and Stack IP Cores.
  • Universal BLE Audio Streaming
  • Flexible integrated modem compatible with Bluetooth, 802.15.4, and other modulations
  • Long Range and Direction Finding (DF) options.
  • Industrial temperature range: -40°C to +85°


  • TWS earbuds, Headsets
  • Smart Speakers, Wearables