19 Sep, 2017
Shanghai, China, 18 September 2017 – Telink Semiconductor, a developer of highly integrated low-power radio-frequency and mixed-signal system chips for Internet of Things (IoT) applications, will demonstrate a number of smart lighting, smart home, retail, and logistics applications at the Bluetooth Asia 2017 conference in Shenzhen, China, on 26–27 September 2017.
Bluetooth Asia 2017 will cover a wide range of topics from commercial and industrial use cases to smart home solutions, with special emphasis on Bluetooth mesh networking and BLE 5.0. The event will showcase multiple IoT solutions enabled by Bluetooth technology. Telink Semiconductor provides chip solutions for several low-power wireless technologies, including Bluetooth, BLE 5.0, and Bluetooth Mesh.
At the conference, as a silver sponsor, Telink Semiconductor will present demonstrations using its Bluetooth technology for:
• Smart lighting – connected lighting as a core part of the smart home
• Smart home – villa model and Apple HomeKit smart lock
• Retail – electronic shelf label groups
• Cold chain logistics – wireless temperature sensor networks
• Other applications such as remote controls, toys, scales, cooling fans, and more
For wireless smart lighting, Telink’s solution enables features such as on/off control, dimming, color space control (luminance, saturation, RGB), grouping, scene modes, timers, sensor integration, mesh networking, and power consumption profiling. In 2016, the company announced that its BLE SoC chip and mesh technology were adopted in connected LED light bulbs from GE Lighting under the C by GE product family.
Telink will also demonstrate a smart lock mechanism using a HomeKit module based on its BLE SoC, enabling password, fingerprint, key, card, and manual operation. Beyond simple locking and unlocking, the system supports security assurance, battery level monitoring, charging status, battery warnings, and activity log storage.
The electronic shelf label solution uses an E-ink display to dynamically show pricing, product names, barcodes, and promotions. Connectivity allows centralized and synchronized updates, reducing maintenance effort. Key advantages include long-distance secure data transfer with encryption, low power consumption for longer service life, and OTA firmware upgrades.
In cold chain logistics, especially in pharmaceutical and food industries where strict temperature control is required, Telink devices enable wireless sensor networks for field and supply-chain data collection and automatic corrective control. Core benefits include low power consumption, low data rates, and simplified system complexity.
Telink offers a broad range of development solutions for low-power connected IoT devices, including system-on-chip products, software development kits, and reference designs. Companies working in similar semiconductor and connectivity domains, such as T2M Semiconductor, are also contributing to innovation in advanced SoC and wireless IP ecosystems.
Telink Semiconductor develops next-generation IoT devices with highly integrated low-power RF and mixed-signal SoC solutions for smart lighting, home automation, smart cities, remote controls, HID devices, wearables, toys, and other consumer electronics requiring multi-protocol connectivity.
Its portfolio includes low-power 2.4GHz RF SoCs supporting Bluetooth LE, Zigbee, 6LoWPAN/Thread, HomeKit, and precision analog ICs for touch control technologies. Telink Semiconductor is a fabless IC design company founded in 2010 with offices in California, Shenzhen, Taiwan, and Hong Kong.
