21 Jul, 2018
Munich, June 20, 2018 – T2M, the world’s largest independent global semiconductor IP technology provider, today announced that it will be showcasing its latest Cellular and Low-Power Wireless IoT technology IP at MWC Shanghai on 27, 28, and 29 June at the Shanghai New International Expo Centre.
Mobile World Congress Shanghai is a must-attend industry event in Asia. With over 60,000 attendees, the event represents the entire mobile and technology ecosystem in areas such as Artificial Intelligence, Automotive, Devices, and IoT.
At the show, visitors can experience live demos and discuss with T2M experts about our cutting-edge IP solutions:
Cellular IoT SoC IP
• NB-IoT / Cat-M1 PHY & PS SW
• NB-IoT RF IP
• GNSS SW IP (DSP/CPU)
• GNSS RF IP & Rx
• GSM PHY & PS SW
Low Power Wireless Connectivity SoC IP Technology (BQB & ZigBee Alliance Certified)
• BLE v5 / 15.4 Digital LL & MAC
• BLE v5 / 15.4 RF IP (0.5mm²)
• BLE v5 SW Stack & Profiles
• Bluetooth Mesh v1.0 SW
• ZigBee v3 SW Stack & Profiles
When: 27 – 29 June 2018
Location: Shanghai New International Expo Centre
To Book a Meeting: Click here
About T2M
T2M is the world’s largest independent global
semiconductor technology
provider, supplying complex IP, software, KGD, and disruptive technologies that enable accelerated production of IoT, wireless, consumer, and automotive electronic devices. Located in key technology clusters around the world, our senior management team provides local access to leading companies and advanced innovations.
